Each pressure plate of CP series chemical mechanical polishing machine with independent driving of pressure plate is driven by a separate servo reducer. Unlike the way that the central guide roller driven CP machine is driven by friction, the pressure plate independent driving CP machine can realize accurate speed control of pressure plate. At the same time, due to the structure of avoiding friction contact in the polishing area, the generation of crystal particles of polishing slurry is reduced, Thus, the probability of particle pollution and scratch on the surface of the wafer is reduced; The rotating speed of each pressure plate of IDP machine can be set separately. According to the characteristics of the pressurizing cylinder of each pressure plate, the processing results in almost zero difference between different pressure plates can be achieved by fine adjustment of the rotating speed of the pressure plates.

For IDP machines with large size, positioning and station switching of ceramic plates can be realized by adding internal and external guide rollers devices, so as to realize the loading and unloading in one station. It can also realize the connection of multiple machines by integrating manipulator to form an automatic production line.

IDP TYPE CP series chemical mechanical polishing machine

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